---
product_id: 345663798
title: "Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure"
brand: "epoxy international"
price: "Rp650128"
currency: IDR
in_stock: true
url: https://www.desertcart.id/products/345663798-strong-bond-112-rigid-epoxy-staking-compound-2-part-medium
store_origin: ID
region: Indonesia
---

# Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure

**Brand:** epoxy international
**Price:** Rp650128
**Availability:** ✅ In Stock

## Quick Answers

- **What is this?** Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure by epoxy international
- **How much does it cost?** Rp650128 with free shipping
- **Is it available?** Yes, in stock and ready to ship
- **Where can I buy it?** [www.desertcart.id](https://www.desertcart.id/products/345663798-strong-bond-112-rigid-epoxy-staking-compound-2-part-medium)

## Best For

- epoxy international enthusiasts

## Why This Product

- Trusted epoxy international brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Description

Mix Ratio by weight: 100:22 / Resin:Hardener Substrates: Metals, glass, ceramics, wood and many plastics Operating Temperature: -60 to 125 C Typical Applications: Printed circuit board repair, staking components, bonding, laminating and repair applications Viscosity @ 25 C, mPas (cP): 60000 cPs Thixotropic Index: 6.5 Specific Gravity, mixed: 1.2 Reactive solids contents, %: 100 Pot Life: 30 minutes 4 hours: @ 65C 24 hours: @ 25C Volume Resistivity: 6.00e+13 ohm-cm Dielectric Constant: 4.6 Dielectric Strength: 16.1 kV/in CTE, linear: 55.0 m/m-C@ Temperature 20.0 C Glass Transition Temp, Tg: 93 C Hardness, Shore D: 90 Lap shear: 1900 psi (Alum to Alum) Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply the mixed adhesive to the prepared surfaces, and gently press these surfaces to

## Features

- Appearance: Milky translucent
- Cure Type: Room temperature or Heat Cure
- Benefits: Tough enamel like cure Bonds variety of substrates Good electrical insulation Weather resistant
- Mix Ratio by weight: 100:22 / Resin:Hardener
- Substrates: Metals, glass, ceramics, wood and many plastics

## Images

![Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure - Image 1](https://m.media-amazon.com/images/I/31G5RieAF5L.jpg)
![Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure - Image 2](https://m.media-amazon.com/images/I/51+tOSiabnL.jpg)

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**Shop now:** [https://www.desertcart.id/products/345663798-strong-bond-112-rigid-epoxy-staking-compound-2-part-medium](https://www.desertcart.id/products/345663798-strong-bond-112-rigid-epoxy-staking-compound-2-part-medium)

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*Product available on Desertcart Indonesia*
*Store origin: ID*
*Last updated: 2026-02-13*